Tongfu Microelectronics | Sustainability Performance

https://www.tfme.com/

Provides semiconductor packaging, testing, and related services.

1997

China

10,001+ employees

Semiconductors

$1B - 10B in revenue

$100M - 500M in profitability

Submit or report inaccurate data Download Company Insights

Sustainability Ranking & Industry Benchmark

#11680

Overall

#769

in China

#174

in Semiconductors

Sustainability Maturity

Sustainability Intent

Available in
Scale package

Access

Industry Rank

168 out of 197

Overview

Environmental

Nature and biodiversityClimate risk

Social

Diversity and InclusionPay GapsExternalities

Governance

TargetsSDG ImpactESG scores and Exclusions

Financial Data

Business performanceCapital & innovationAnalyst projections

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China, Hardware & Networking, Telecommunications

Female employees

37% 2024

Leading

Externalities

17.1M $, 2024

Critical

Market cap

105.7B $, 2026▼66.9% YoY

Revenue

23.9B $, 2024▼6.8% YoY

R&D intensity

5.72% 2024

Controversy level

Very Low

Low

Noticeable

High

Severe

Download Controversy Analysis

Tongfu Microelectronics Co Ltd, Chinese major IC packaging/testing OSAT, has faced sustained US BIS export control compliance scrutiny over the contested 2024 sustained USChina semiconductor decoupling pressure on advanced packaging, plus periodic Chinese SAMR enforcement scrutiny on alleged inadequate disclosure of customer concentration affecting Chinese institutional shareholders.

Biodiversity impact

Reveal data for 2 credits

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Land use

Reveal data for 2 credits

KPI	Metric	Year
		2020	2021	2022	2023	2024	Benchmark
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Diversity & inclusion

Reveal data for 3 credits

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		2020	2021	2022	2023	2024	Benchmark
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Pay gap breakdown

Reveal data for 1 credit

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		2020	2021	2022	2023	2024	Benchmark
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Externalities

Reveal data for 1 credit

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		2020	2021	2022	2023	2024	Benchmark
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SDG impact (historical)

Reveal data for 5 credits

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		2019	2020	2021	2022	2023	Benchmark
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Reporting

Sustainability Report

Available

Not committed to key sustainability initiatives

Sustainability employees

Available in
Scale package

Access

Controversy level

Very Low

Low

Noticeable

High

Severe

Download Controversy Analysis

Tongfu Microelectronics Co Ltd, Chinese major IC packaging/testing OSAT, has faced sustained US BIS export control compliance scrutiny over the contested 2024 sustained USChina semiconductor decoupling pressure on advanced packaging, plus periodic Chinese SAMR enforcement scrutiny on alleged inadequate disclosure of customer concentration affecting Chinese institutional shareholders.

Tongfu Microelectronics | Sustainability Performance

Sustainability Ranking & Industry Benchmark

Sustainability Maturity

Sustainability Intent

Available in Scale package

View similiar companies

Female employees

Controversy level

Climate risk

Biodiversity loss in km²

Biodiversity loss in CO2e

Potential species loss

Biodiversity impact

Land use

Diversity & inclusion

Pay gap breakdown

Externalities

Revenue & EBITDA

Margin trends

R&D intensity

Return on invested capital

Analyst revenue estimates & actuals

Environmental policy coverage

Overall score

Environment

Social

Governance

Exclusion screening

SDG impact

SDG impact (historical)

Reporting

Sustainability employees

Available in Scale package

Tongfu Microelectronics | Sustainability Performance

Sustainability Ranking & Industry Benchmark

Sustainability Maturity

Sustainability Intent

Available in Scale package

View similiar companies

Female employees

Controversy level

Climate risk

Biodiversity loss in km²

Biodiversity loss in CO2e

Potential species loss

Biodiversity impact

Land use

Diversity & inclusion

Pay gap breakdown

Externalities

Revenue & EBITDA

Margin trends

R&D intensity

Return on invested capital

Analyst revenue estimates & actuals

Environmental policy coverage

Overall score

Environment

Social

Governance

Exclusion screening

SDG impact

SDG impact (historical)

Reporting

Sustainability employees

Available in Scale package

Available in
Scale package

Available in
Scale package

Available in
Scale package

Available in
Scale package